Invention Grant
- Patent Title: Bonding structure and display device including the same
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Application No.: US16939866Application Date: 2020-07-27
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Publication No.: US11586258B2Publication Date: 2023-02-21
- Inventor: Hayoung Choi , Chung-Seok Lee
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2019-0150591 20191121
- Main IPC: G06F1/18
- IPC: G06F1/18

Abstract:
A display device includes a display panel, a bonding substrate and a bridge board. The display panel includes a pixel array disposed on a base substrate and an input pad electrically connected to the pixel array. The bonding substrate is disposed under the display panel and includes an output pad. The bridge board is bonded to the input pad of the display panel and the output pad of the bonding substrate to electrically connect the display panel to the bonding substrate, wherein the bridge board includes a rigid material.
Public/Granted literature
- US20210157374A1 BONDING STRUCTURE AND DISPLAY DEVICE INCLUDING THE SAME Public/Granted day:2021-05-27
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