Invention Grant
- Patent Title: Heat-dissipating, shock-absorbing structure
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Application No.: US17370106Application Date: 2021-07-08
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Publication No.: US11587594B2Publication Date: 2023-02-21
- Inventor: Hung-Chan Cheng
- Applicant: Getac Technology Corporation
- Applicant Address: TW Hsinchu County
- Assignee: Getac Technology Corporation
- Current Assignee: Getac Technology Corporation
- Current Assignee Address: TW Hsinchu County
- Agency: Locke Lord LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: TW107101617 20180117
- Main IPC: G11B33/08
- IPC: G11B33/08 ; G11B33/02 ; G11B33/14 ; G11B33/12 ; H05K5/04 ; G11B5/48 ; H05K13/00

Abstract:
Provided is a heat-dissipating, shock-absorbing structure which is applicable to an electronic module with a hard disk drive. The heat-dissipating, shock-absorbing structure includes a heat-dissipating frame, an elastomer, and a plurality of heat conduction layers. The heat-dissipating frame has a fixing segment and two extending segments. The extending segments connect with two ends of the fixing segment. The fixing segment connects with one side of the hard disk drive. The distance between the extending segments is greater than the thickness of the hard disk drive. At least a portion of the elastomer is disposed at the extending segments. The heat conduction layers cover the elastomer.
Public/Granted literature
- US20210335392A1 HEAT-DISSIPATING, SHOCK-ABSORBING STRUCTURE Public/Granted day:2021-10-28
Information query
IPC分类: