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公开(公告)号：US11189323B2
公开(公告)日：2021-11-30
申请号：US16171483
申请日：2018-10-26
Applicant: Getac Technology Corporation
Inventor： Hung-Chan Cheng
Abstract: Provided is a heat-dissipating, shock-absorbing structure which is applicable to an electronic module with a hard disk drive. The heat-dissipating, shock-absorbing structure includes a heat-dissipating frame, an elastomer, and a plurality of heat conduction layers. The heat-dissipating frame has a fixing segment and two extending segments. The extending segments connect with two ends of the fixing segment. The fixing segment connects with one side of the hard disk drive. The distance between the extending segments is greater than the thickness of the hard disk drive. At least a portion of the elastomer is disposed at the extending segments. The heat conduction layers cover the elastomer.
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Patent Agency Ranking
公开(公告)号：US20210059070A1
公开(公告)日：2021-02-25
申请号：US16547783
申请日：2019-08-22
Applicant: Getac Technology Corporation
Inventor： Hung-Chan Cheng , Wei-Chung Hsiao
Abstract: The present invention relates to a heat dissipation module and an assembly method thereof. The heat dissipation module includes a heat conductive plate and a buffer member. The heat conductive plate includes a cover section and a first extension section. The cover section covers a heat zone. The buffer member is provided at the heat conductive plate to interferingly match with a housing, so as to conduct heat energy produced by the heat zone to the housing. Accordingly, by configuring the buffer member between the heat conductive plate and the housing, the heat conductive plate is allowed to be reliably thermally adhered to the housing, thereby achieving enhanced heat dissipation efficiency for the heat dissipation module.
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公开(公告)号：US12222783B2
公开(公告)日：2025-02-11
申请号：US18150958
申请日：2023-01-06
Applicant: Getac Technology Corporation
Inventor： Wan-Lin Hsu , Juei-Chi Chang , Hung-Chan Cheng
Abstract: An electronic device includes a housing and a first heat source, a second heat source, and a heat dissipation module that are disposed in the housing. The heat dissipation module includes a first fan, a second fan, a first heat conduction member, and a second heat conduction member. The first fan and the second fan are disposed on two opposite sides of the housing. One end of the first heat conduction member is disposed at the first fan, and the other end is located at a position on a side of an upper surface of the housing corresponding to the first heat source. One end of the second heat conduction member is disposed at the second fan, and the other end is located on a side of a lower surface of the housing and abuts against the second heat source.
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公开(公告)号：US12178017B2
公开(公告)日：2024-12-24
申请号：US17981321
申请日：2022-11-04
Applicant: GETAC TECHNOLOGY CORPORATION
Inventor： Wan-Lin Hsu , Hung-Chan Cheng
Abstract: An electronic device including a first shell, a second shell, a circuit board, a heat conductive member and a heat source. The first shell is made of a metal material. The second shell is disposed on a side of the first shell. The circuit board is disposed between the first shell and the second shell, and includes a through hole that passes through both sides. The heat conductive member includes a first contact portion, an extending section and a second contact portion connected in a sequential manner. The first contact portion is located on one side of the circuit board, the second contact portion is located on the other side of the circuit board, the extending section extends through the through hole, and the first contact portion abuts against the first shell. The heat source is connected to the second contact portion.
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公开(公告)号：US11587594B2
公开(公告)日：2023-02-21
申请号：US17370106
申请日：2021-07-08
Applicant: Getac Technology Corporation
Inventor： Hung-Chan Cheng
Abstract: Provided is a heat-dissipating, shock-absorbing structure which is applicable to an electronic module with a hard disk drive. The heat-dissipating, shock-absorbing structure includes a heat-dissipating frame, an elastomer, and a plurality of heat conduction layers. The heat-dissipating frame has a fixing segment and two extending segments. The extending segments connect with two ends of the fixing segment. The fixing segment connects with one side of the hard disk drive. The distance between the extending segments is greater than the thickness of the hard disk drive. At least a portion of the elastomer is disposed at the extending segments. The heat conduction layers cover the elastomer.
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公开(公告)号：US10939584B1
公开(公告)日：2021-03-02
申请号：US16547783
申请日：2019-08-22
Applicant: Getac Technology Corporation
Inventor： Hung-Chan Cheng , Wei-Chung Hsiao
Abstract: The present invention relates to a heat dissipation module and an assembly method thereof. The heat dissipation module includes a heat conductive plate and a buffer member. The heat conductive plate includes a cover section and a first extension section. The cover section covers a heat zone. The buffer member is provided at the heat conductive plate to interferingly match with a housing, so as to conduct heat energy produced by the heat zone to the housing. Accordingly, by configuring the buffer member between the heat conductive plate and the housing, the heat conductive plate is allowed to be reliably thermally adhered to the housing, thereby achieving enhanced heat dissipation efficiency for the heat dissipation module.
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