Invention Grant
- Patent Title: Substrate bonding apparatus and method of manufacturing semiconductor device by using the substrate bonding apparatus
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Application No.: US16892492Application Date: 2020-06-04
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Publication No.: US11594443B2Publication Date: 2023-02-28
- Inventor: Hoechul Kim , Taeyeong Kim , Hakjun Lee , Hoonjoo Na
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2019-0103312 20190822
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/50 ; H01L23/00 ; H01L21/603
Abstract:
A substrate bonding apparatus includes a first bonding chuck configured to support a first substrate and a second bonding chuck configured to support a second substrate such that the second substrate faces the first substrate. The first bonding chuck includes a first base, a first deformable plate on the first base and configured to support the first substrate and configured to be deformed such that a distance between the first base and the first deformable plate is varied, and a first piezoelectric sheet on the first deformable plate and configured to be deformed in response to power applied thereto to deform the first deformable plate.
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