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    Substrate bonding apparatus
    1.
    发明授权
    Substrate bonding apparatus 有权

    公开(公告)号：US10923452B2

    公开(公告)日：2021-02-16

    申请号：US16783342

    申请日：2020-02-06

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Ilyoung Han ,  Taeyeong Kim ,  Jihoon Kang ,  Nohsung Kwak ,  Seokho Kim ,  Hoechul Kim ,  Ilhyoung Lee ,  Hakjun Lee

    IPC: H01L23/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/683

    Abstract: A substrate bonding apparatus for bonding a first substrate to a second substrate includes: a first bonding chuck including: a first base; a first deformable plate provided on the first base to support the first substrate; and a first pneumatic adjustor configured to deform the first deformable plate by adjusting a first pressure in a first cavity formed between the first deformable plate and the first base; and a second bonding chuck including: a second base; a second deformable plate provided on the second base to support the second substrate; and a second pneumatic adjustor configured to deform the second deformable plate by adjusting a second pressure in a second cavity formed between the second deformable plate and the second base. The first deformable plate is deformed such that a first distance between the first base and the first deformable plate is varied based on the first pressure, and the second deformable plate is deformed such that a second distance between the second base the second deformable plate is varied based on the second pressure.

    Wafer to wafer bonding apparatus and wafer to wafer bonding method
    3.
    发明授权
    Wafer to wafer bonding apparatus and wafer to wafer bonding method 有权

    公开(公告)号：US11728197B2

    公开(公告)日：2023-08-15

    申请号：US17218606

    申请日：2021-03-31

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jaehyun Phee ,  Hoechul Kim ,  Seokho Kim ,  Taeyeong Kim ,  Hoonjoo Na

    IPC: H01L21/68 ,  H01L21/67 ,  H01L21/683

    CPC classification number: H01L21/681 ,  H01L21/67092 ,  H01L21/6838

    Abstract: A wafer bonding apparatus including a first stage having a first surface and being configured to hold a first wafer on the first surface; a second stage having a second surface and being configured to hold a second wafer on the second surface facing the first surface; a first target image sensor on an outer portion of the first stage; a second target image sensor on an outer portion of the second stage; and a target portion on the first or second stage, the target portion having a target plate fixedly installed and spaced apart from the first or second target image sensor by a predetermined distance, wherein, in an alignment measurement of the first and second stages, the first and second stages are movable so that the first and second target image sensors face each other and the target plate is between the first and second target image sensors.

    Electronic device having extendable display and method for providing content thereof
    6.
    发明授权
    Electronic device having extendable display and method for providing content thereof 有权

    公开(公告)号：US11922842B2

    公开(公告)日：2024-03-05

    申请号：US17749684

    申请日：2022-05-20

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Myunghoon Kwak ,  Moonjeong Kim ,  Taeyeong Kim ,  Sunghwan Park ,  Jookwan Lee ,  Yangwook Kim ,  Jihea Park

    IPC: G06F3/04886 ,  G09G3/00 ,  H04M1/02 ,  H04W4/21 ,  G06F3/04817 ,  G06F3/0482

    CPC classification number: G09G3/035 ,  G06F3/04886 ,  H04M1/0268 ,  H04W4/21 ,  G06F3/04817 ,  G06F3/0482 ,  G09G2354/00 ,  G09G2370/022 ,  H04M2250/12

    Abstract: An electronic device according to various embodiments may include: a housing, a flexible display having at least a partial area configured to be drawn out from the housing so that a size of a visible area of the flexible display can be changed, a sensor configured to measure a length of the flexible display, a memory, a processor operatively connected to the memory, the sensor, and the flexible display. The processor may be configured to control the electronic device to: display a first content including at least one image in a first area including a partial area of the flexible display in response to an input, measure a length of the flexible display drawn out from the housing using the sensor, based on the length of the flexible display measured using the sensor being a specified first length, determine that the electronic device is in a non-expanded state, and based on the length of the flexible display measured using the sensor being a second length longer than the first length, determine that the electronic device is in an expanded state. In addition, the processor may be configured to control the electronic device to: based on the electronic device being in an expanded state, display the first content in the first area, and display a user interface corresponding to at least one application and/or second content obtained by converting the first content into a form corresponding to a function provided by the at least one application in a second area including a partial area of the flexible display, drawn out from the housing to be visible, and transmit, in response to an input, data corresponding to the first content to a server connected to the at least one application.

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    7.
    发明公开
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20230335415A1

    公开(公告)日：2023-10-19

    申请号：US18337202

    申请日：2023-06-19

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyungjun Jeon ,  Taeyeong Kim ,  Hoechul Kim ,  Junhong Min

    IPC: H01L21/67 ,  H01L23/00 ,  B32B37/00 ,  B32B41/00

    CPC classification number: H01L21/67017 ,  H01L24/74 ,  H01L21/67092 ,  B32B37/0046 ,  B32B37/003 ,  B32B41/00 ,  B32B2457/14 ,  H01L21/68742

    Abstract: A bonding method for bonding a first substrate to a second substrate includes fixing the first substrate to a first surface of a first bonding chuck and fixing the second substrate to a second surface of a second bonding chuck, the second surface facing the first surface; aligning the second bonding chuck above the first bonding chuck in a vertical direction or in a horizontal direction; bonding the first substrate to the second substrate to make a bonded substrate; and wherein, in the bonding the first substrate to the second substrate, injecting a process gas between the first substrate and the second substrate using a process gas injector surrounding at least one selected from the first bonding chuck and the second bonding chuck in a plan view and injecting an air curtain forming gas to form an air curtain surrounding the first substrate and the second substrate using an air curtain generator are performed in combination.

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