Invention Grant
- Patent Title: Semiconductor package and method of manufacturing semiconductor package
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Application No.: US17245978Application Date: 2021-04-30
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Publication No.: US11594516B2Publication Date: 2023-02-28
- Inventor: Aenee Jang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2020-0112238 20200903
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/065 ; H01L23/31 ; H01L23/498

Abstract:
A semiconductor package includes a package substrate, an interposer provided on the package substrate, a plurality of semiconductor devices on the interposer and spaced apart from each other, and electrically connected to each other through the interposer, at least one dummy member on the interposer to cover at least one corner portion of the interposer and arranged spaced apart from a first semiconductor device among the plurality of semiconductor devices, and a sealing member contacting the interposer and filling a space between the first semiconductor device and the at least one dummy member so as to cover a first side surface of the first semiconductor device, a first side surface of the at least one dummy member, and an upper surface of the dummy member. A second side surface, opposite to the first side surface, of the at least one dummy member is uncovered by the sealing member.
Public/Granted literature
- US20220068881A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE Public/Granted day:2022-03-03
Information query
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