Invention Grant
- Patent Title: Packaged integrated circuit devices with through-body conductive vias, and methods of making same
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Application No.: US17751460Application Date: 2022-05-23
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Publication No.: US11594525B2Publication Date: 2023-02-28
- Inventor: Tongbi Jiang , Yong Poo Chia
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L25/07
- IPC: H01L25/07 ; H01L25/00 ; H01L23/31 ; H01L23/48 ; H01L21/768 ; H01L21/82 ; H01L23/00 ; H01L21/56 ; H01L23/538 ; H01L25/10
Abstract:
A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.
Public/Granted literature
- US20220285325A1 PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VIAS, AND METHODS OF MAKING SAME Public/Granted day:2022-09-08
Information query
IPC分类:
