- Patent Title: Multilevel semiconductor device and structure with oxide bonding
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Application No.: US17868776Application Date: 2022-07-20
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Publication No.: US11594526B2Publication Date: 2023-02-28
- Inventor: Zvi Or-Bach , Deepak C. Sekar , Brian Cronquist
- Applicant: Monolithic 3D Inc.
- Applicant Address: US OR Klamath Falls
- Assignee: Monolithic 3D Inc.
- Current Assignee: Monolithic 3D Inc.
- Current Assignee Address: US OR Klamath Falls
- Agency: Patent PC
- Agent Bao Tran
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L33/16 ; H01L33/30 ; H01L33/62

Abstract:
A multi-level semiconductor device, the device including: a first level including integrated circuits; a second level including a structure designed to conduct electromagnetic waves, where the second level is disposed above the first level, where the integrated circuits include single crystal transistors; and an oxide layer disposed between the first level and the second level, where the second level is bonded to the oxide layer, and where the bonded includes oxide to oxide bonds.
Public/Granted literature
- US20220359473A1 MULTILEVEL SEMICONDUCTOR DEVICE AND STRUCTURE WITH OXIDE BONDING Public/Granted day:2022-11-10
Information query
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