Invention Grant
- Patent Title: Nonvolatile memory device with h-shaped blocks and method of fabricating the same
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Application No.: US16852907Application Date: 2020-04-20
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Publication No.: US11594550B2Publication Date: 2023-02-28
- Inventor: Kang Min Kim , Seung Min Song , Jae Hoon Shin , Joong Shik Shin , Geun Won Lim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2019-0125849 20191011
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L27/11573 ; H01L23/528 ; H01L21/311 ; H01L27/11565

Abstract:
A nonvolatile memory device with improved product reliability and a method of fabricating the same is provided. The nonvolatile memory device comprises a substrate, a first mold structure disposed on the substrate and including a plurality of first gate electrodes, a second mold structure disposed on the first mold structure and including a plurality of second gate electrodes and a plurality of channel structures intersecting the first gate electrodes and the second gate electrodes by penetrating the first and second mold structures, wherein the first mold structure includes first and second stacks, which are spaced apart from each other, and the second mold structure includes a third stack, which is stacked on the first stack, a fourth stack, which is stacked on the second stack, and first connecting parts, which connect the third and fourth stacks.
Public/Granted literature
- US20210111186A1 NONVOLATILE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2021-04-15
Information query
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