Invention Grant
- Patent Title: Bulk-acoustic wave resonator
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Application No.: US16395486Application Date: 2019-04-26
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Publication No.: US11595016B2Publication Date: 2023-02-28
- Inventor: Tae Kyung Lee , Jin Suk Son , Je Hong Kyoung , Sung Sun Kim , Ran Hee Shin , Hwa Sun Lee
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2018-0118730 20181005,KR10-2018-0149571 20181128
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/17

Abstract:
A bulk-acoustic wave resonator includes: a substrate; a seed layer disposed on the substrate, and having a hexagonal crystal structure; a bottom electrode disposed on the seed layer; a piezoelectric layer at least partially disposed on the bottom electrode; and a top electrode disposed on the piezoelectric layer, wherein either one or both of the bottom electrode and the top electrode includes a scandium (Sc)-containing aluminum alloy layer.
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