Invention Grant
- Patent Title: Techniques for enhanced machine type communication acknowledgment bundling
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Application No.: US16685755Application Date: 2019-11-15
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Publication No.: US11595161B2Publication Date: 2023-02-28
- Inventor: Kapil Bhattad , Alberto Rico Alvarino
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Priority: IN201741004051 20170203
- Main IPC: H04L1/18
- IPC: H04L1/18 ; H04W72/04 ; H04L1/16 ; H04L5/00 ; H04L5/16 ; H04L1/1829 ; H04L1/1812 ; H04W72/0446 ; H04L1/1607 ; H04L1/1867

Abstract:
Techniques and apparatus for hybrid automatic retransmission request (HARQ) acknowledgement (ACK) bundling in half duplex frequency division duplexing (HD-FDD) systems are provided. One technique includes determining ACK parameter(s) to be used for acknowledging a bundled transmission that includes instance(s) of a channel across subframe(s). An indication of the ACK parameter(s) is signaled to a user equipment (UE). The ACK parameter(s) include a first ACK parameter that conveys a size of the bundled transmission and a second ACK parameter that conveys an amount of time for the UE to delay acknowledging a data transmission in an instance of the channel after receiving the data transmission. The UE may acknowledge the bundled transmission in accordance with the ACK parameter(s).
Public/Granted literature
- US20200083992A1 TECHNIQUES FOR ENHANCED MACHINE TYPE COMMUNICATION ACKNOWLEDGMENT BUNDLING Public/Granted day:2020-03-12
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