Invention Grant
- Patent Title: Optoelectronic sensor module and method for producing an optoelectronic sensor module
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Application No.: US16604083Application Date: 2018-05-03
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Publication No.: US11596333B2Publication Date: 2023-03-07
- Inventor: Luca Haiberger
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater Matsil, LLP
- Priority: DE102017110216.7 20170511
- International Application: PCT/EP2018/061355 WO 20180503
- International Announcement: WO2018/206391 WO 20181115
- Main IPC: A61B5/1455
- IPC: A61B5/1455 ; A61B5/00 ; H01L25/16

Abstract:
An optoelectronic sensor module and a method for producing an optoelectronic sensor module are disclosed. In an embodiment an optoelectronic sensor module includes a first semiconductor transmitter chip configured to emit radiation of a first wavelength, a second semiconductor transmitter chip configured to emit radiation of a second wavelength different from the first wavelength, a semiconductor detector chip configured to detect the radiation of the first and second wavelengths, and a first potting body being opaque to the radiation of the first and the second wavelength, wherein the first potting body directly covers side surfaces of the chips and mechanically connects the chips located in a common plane to one another, wherein a distance between the chips is less than or equal to twice an average diagonal length of the chips, and wherein the sensor module is adapted to rest against a body part to be examined.
Information query