An imaging system includes: a micro computed tomography (micro-CT) subsystem, a specimen processing subsystem, a scanning electron microscopy (SEM) and a processor. The micro-CT subsystem includes an X-ray source and an X-ray detector, and is configured to acquire a three-dimensional image of a specimen. The specimen processing subsystem includes a focused ion beam subsystem and a mechanical cutting device. The focused ion beam subsystem is configured to process the specimen in a first processing manner, and the mechanical cutting device is configured to process the specimen in a second processing manner to obtain a target section of a target area. The SEM is located above the specimen and is configured to acquire a two-dimensional image of the target section. The processor is configured to perform three-dimensional reconstruction on the two-dimensional images to obtain a three-dimensional imaging of the specimen.