Invention Grant
- Patent Title: Multilayer ceramic electronic component
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Application No.: US17474488Application Date: 2021-09-14
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Publication No.: US11600442B2Publication Date: 2023-03-07
- Inventor: Won Kuen Oh , Hye Hun Park , Gyu Ho Yeon , Sung Hyun Kang
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2020-0189785 20201231
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30 ; H01G4/248

Abstract:
A multilayer ceramic electronic component including: a ceramic body including a dielectric layer and first and second internal electrodes; a first external electrode including a first base electrode disposed to be in contact with the ceramic body and a first conductive layer disposed on the first base electrode; and a second external electrode including a second base electrode disposed to be in contact with the ceramic body and a second conductive layer disposed on the second base electrode, wherein the first conductive layer and the second conductive layer include silver (Ag) and palladium (Pd) and distribution positions of silver (Ag) and palladium (Pd) in central portions of the first conductive layer and the second conductive layer match at 95% or more according to a result of TEM mapping.
Public/Granted literature
- US20220208460A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2022-06-30
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