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    MULTILAYER CAPACITOR
    1.
    发明申请
    MULTILAYER CAPACITOR 有权

    公开(公告)号：US20220223348A1

    公开(公告)日：2022-07-14

    申请号：US17706777

    申请日：2022-03-29

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Won Kuen Oh ,  Hye Hun Park ,  Tae Gyeom Lee

    IPC: H01G4/30 ,  H01G2/06 ,  H01G4/12 ,  H01G4/012

    Abstract: A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.

    Multilayer ceramic electronic component
    2.
    发明授权
    Multilayer ceramic electronic component 有权

    公开(公告)号：US11600442B2

    公开(公告)日：2023-03-07

    申请号：US17474488

    申请日：2021-09-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Won Kuen Oh ,  Hye Hun Park ,  Gyu Ho Yeon ,  Sung Hyun Kang

    IPC: H01G4/232 ,  H01G4/30 ,  H01G4/248

    Abstract: A multilayer ceramic electronic component including: a ceramic body including a dielectric layer and first and second internal electrodes; a first external electrode including a first base electrode disposed to be in contact with the ceramic body and a first conductive layer disposed on the first base electrode; and a second external electrode including a second base electrode disposed to be in contact with the ceramic body and a second conductive layer disposed on the second base electrode, wherein the first conductive layer and the second conductive layer include silver (Ag) and palladium (Pd) and distribution positions of silver (Ag) and palladium (Pd) in central portions of the first conductive layer and the second conductive layer match at 95% or more according to a result of TEM mapping.

    MULTILAYER CAPACITOR
    4.
    发明申请
    MULTILAYER CAPACITOR 有权

    公开(公告)号：US20210065984A1

    公开(公告)日：2021-03-04

    申请号：US16778965

    申请日：2020-01-31

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Won Kuen Oh ,  Hye Hun Park ,  Tae Gyeom Lee

    IPC: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/12

    Abstract: A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.

    Multilayer capacitor
    6.
    发明授权
    Multilayer capacitor 有权

    公开(公告)号：US11322305B2

    公开(公告)日：2022-05-03

    申请号：US16778965

    申请日：2020-01-31

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Won Kuen Oh ,  Hye Hun Park ,  Tae Gyeom Lee

    IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G2/06

    Abstract: A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.

    Multilayer ceramic electronic parts with conductive resin
    7.
    发明授权
    Multilayer ceramic electronic parts with conductive resin 有权

    公开(公告)号：US11315733B2

    公开(公告)日：2022-04-26

    申请号：US17005775

    申请日：2020-08-28

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hye Hun Park ,  Won Kuen Oh ,  Tae Gyeom Lee ,  Ji Hong Jo

    IPC: H01G4/232 ,  H01G4/30

    Abstract: A multilayer ceramic electronic component includes a ceramic body having a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The conductive carbon is included in the conductive resin layer in an amount of 0.5 to 5.0 parts by weight based on 100 parts by weight of the conductive metal.

    Common mode filter
    8.
    发明授权
    Common mode filter 有权

    公开(公告)号：US10568194B2

    公开(公告)日：2020-02-18

    申请号：US15792237

    申请日：2017-10-24

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Kwang Jik Lee ,  Sang Moon Lee ,  Hye Hun Park ,  Ju Hwan Yang ,  Jung Wook Seo

    IPC: H05F3/04 ,  H01F27/36 ,  H01F27/29 ,  H01F27/32 ,  H03H1/00 ,  H03H7/42 ,  H01F17/00

    Abstract: A common mode filter includes a body including a filter portion and an electrostatic protection portion, first to fourth external electrodes disposed on an external surface of the body, a ground electrode disposed on the external surface of the body, a first coil included in the filter portion and electrically connected to the first and second external electrodes, and a second coil included in the filter portion and electrically connected to the third and fourth external electrodes. The electrostatic protection portion includes discharge electrodes electrically connected to at least one of the first to fourth external electrodes and the ground electrode, a discharge part including conductive particles, a first organic-inorganic composite insulating layer disposed on the discharge electrodes and the discharge part, a magnetic cover layer disposed on the first organic-inorganic composite insulating layer, and a first inorganic insulating layer.

    Multilayer ceramic electronic parts
    10.
    发明授权
    Multilayer ceramic electronic parts 有权

    公开(公告)号：US11721485B2

    公开(公告)日：2023-08-08

    申请号：US17704741

    申请日：2022-03-25

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hye Hun Park ,  Won Kuen Oh ,  Tae Gyeom Lee ,  Ji Hong Jo

    IPC: H01G4/232 ,  H01G4/30

    CPC classification number: H01G4/2325 ,  H01G4/30

    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer. The conductive resin layer includes a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The metal having the lower melting point than the conductive metal is tin (Sn). The conductive metal of the conductive resin layer includes at least one of copper (Cu), nickel (Ni), silver (Ag), and silver-palladium (Ag—Pd).

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