Invention Grant
- Patent Title: Semiconductor package
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Application No.: US17382169Application Date: 2021-07-21
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Publication No.: US11600601B2Publication Date: 2023-03-07
- Inventor: Aenee Jang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2020-0140115 20201027
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/065 ; H01L23/48

Abstract:
A semiconductor package comprising a first semiconductor chip and a second semiconductor chip disposed on the first semiconductor chip, wherein the first semiconductor chip includes a first semiconductor body, an upper pad structure, and a first through-electrode penetrating the first semiconductor body and electrically connected to the upper pad structure, and the second semiconductor chip includes a second semiconductor body, a lower bonding pad, and an internal circuit structure including a circuit element, internal circuit wirings, and a connection pad pattern disposed on the same level as the lower bonding pad, the upper pad structure includes upper bonding pads and connection wirings, the upper bonding pads are disposed at positions corresponding to the lower bonding pad and the connection pad pattern, and the internal circuit structure is electrically connected to the first through-electrode through at least one of the upper bonding pads and the connection wirings.
Public/Granted literature
- US20220130799A1 SEMICONDUCTOR PACKAGE Public/Granted day:2022-04-28
Information query
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