Invention Grant
- Patent Title: Area-efficient balun
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Application No.: US17164494Application Date: 2021-02-01
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Publication No.: US11600916B2Publication Date: 2023-03-07
- Inventor: Sean Joel Lyn , Cheng-Han Wang , Hye Jin Song , Hai Huang , Sang-Oh Lee
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Patterson + Sheridan LLP
- Main IPC: H01Q7/00
- IPC: H01Q7/00 ; H01P5/10 ; H01Q1/50

Abstract:
An area-efficient balun and a method for signal processing using such a balun. One example balun generally includes a winding and a clamping circuit. The winding is formed by a coiled trace including a first portion having a first trace width and a second portion having a second trace width, the second trace width being narrower than the first trace width. The clamping circuit has a first terminal and a second terminal, the first terminal of the clamping circuit being coupled to the first portion of the coiled trace.
Public/Granted literature
- US20210257726A1 AREA-EFFICIENT BALUN Public/Granted day:2021-08-19
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