Invention Grant
- Patent Title: Semiconductor chip with local oscillator buffer reused for loop-back test and associated loop-back test method
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Application No.: US17504491Application Date: 2021-10-18
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Publication No.: US11601147B2Publication Date: 2023-03-07
- Inventor: Jui-Lin Hsu , Hsiang-Yun Chu , Yen-Tso Chen , Jen-Hao Cheng , Wei-Hsiu Hsu , Tzu-Chin Lin , Chih-Ming Hung , Jing-Hong Conan Zhan
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H01P5/10 ; H03H7/42 ; H04B1/30 ; H04B1/3805

Abstract:
A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a loop-back test function through the auxiliary path.
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