Abstract:
A semiconductor chip includes a first wireless communication circuit, a second wireless communication circuit, and an auxiliary path. The first wireless communication circuit includes a signal path, wherein the signal path includes a signal node. The second wireless communication circuit includes a mixer and a local oscillator (LO) buffer. The LO buffer is arranged to receive and buffer an LO signal, and is further arranged to provide the LO signal to the mixer. The auxiliary path is arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a loop-back test function of the first wireless communication circuit through the auxiliary path.
Abstract:
A transceiver includes a radio-frequency (RF) front-end circuit, a dedicated RF front-end circuit, and a switchable matching circuit. The RF front-end circuit deals with communications of at least a first wireless communication standard. The dedicated RF front-end circuit deals with communications of a second wireless communication standard only. The switchable matching circuit is coupled to the RF front-end circuit, the dedicated RF front-end circuit, and a signal port of a chip. The switchable matching circuit provides impedance matching between the signal port and the RF front-end circuit when the RF front-end circuit is in operation, and provides impedance matching between the signal port and the dedicated RF front-end circuit when the dedicated RF front-end circuit is in operation. The RF front-end circuit, the dedicated RF front-end circuit, and the switchable matching circuit are integrated in the chip.
Abstract:
A diplexer, for coupling a first radio frequency (RF) signal corresponding to a first carrier frequency and a second RF signal corresponding to a second carrier frequency is disclosed. The diplexer includes a first port arranged to couple the first RF signal; a second port arranged to couple the second RF signal; a third port capable of connecting an antenna; a first impedance unit coupled to the first port and the third port; and a second impedance unit coupled to the second port and the third port; wherein the first port, the second port and the third port are coupled to a direct current (DC) ground; wherein the first impedance unit is arranged to provide an first open-circuit impedance against the second RF signal, and the second impedance unit is arranged to provide a second open-circuit impedance against the first RF signal.
Abstract:
A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a loop-back test function through the auxiliary path.
Abstract:
A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a loop-back test function through the auxiliary path.
Abstract:
A wireless system includes an active oscillator and a front-end circuit. The active oscillator is used to generate and output a reference clock. The active oscillator includes at least one active component, and does not include an electromechanical resonator. The front-end circuit is used to process a transmit (TX) signal or a receive (RX) signal according to a local oscillator (LO) signal. The LO signal is derived from the reference clock.
Abstract:
A radio-frequency (RF) front-end supporting at least a first and second wireless communication bands includes a mixer arranged for mixing a received signal with a first local oscillation signal when the shared receiver front-end performs the reception operation according to the first wireless communication band, and for mixing the received signal with a second local oscillation signal when the shared receiver front-end performs the reception operation according to the second wireless communication band, wherein the first and second local oscillation signals are different in frequency.
Abstract:
A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a transmit (TX) function through the auxiliary path.
Abstract:
A wireless system includes an active oscillator and a front-end circuit. The active oscillator is used to generate and output a reference clock. The active oscillator includes at least one active component, and does not include an electromechanical resonator. The front-end circuit is used to process a transmit (TX) signal or a receive (RX) signal according to a local oscillator (LO) signal. The LO signal is derived from the reference clock.
Abstract:
A transceiver includes: a radio-frequency (RF) front-end circuit; a dedicated RF front-end circuit; and a switchable matching circuit, integrated in a chip. The RF front-end circuit deals with communications of a first wireless standard, and the dedicated RF front-end circuit deals with communications of a second wireless standard. The switchable matching circuit provides impedance matching between the signal port and the RF front-end circuit when the RF front-end circuit is in operation, and provides impedance matching between the signal port and the dedicated RF front-end circuit when the dedicated RF front-end circuit is in operation, and includes: a first capacitive circuit coupled to the signal port; a first switch circuit coupled between the first capacitive circuit and the dedicated RF front-end circuit; a second capacitive circuit coupled to the dedicated RF front-end circuit; and a second switch circuit coupled to a second terminal of the second capacitive circuit.