A scalable switching regulator architecture may include an integrated inductor. The integrated inductor may include vias or pillars in a multi-layer substrate, with selected vias coupled at one end by a redistribution layer of the multi-layer substrate and, variously, coupled at another end by a metal layer of a silicon integrated circuit chip or by a further redistribution layer of the multi-layer substrate. The vias may be coupled to the silicon integrated circuit chip by micro-balls, with the vias and micro-balls arranged in arrays.