Invention Grant
- Patent Title: Light emitting element and light emitting device
-
Application No.: US17378422Application Date: 2021-07-16
-
Publication No.: US11605769B2Publication Date: 2023-03-14
- Inventor: Hiroaki Kageyama
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Foley & Lardner LLP
- Priority: JPJP2020-125203 20200722
- Main IPC: H01L33/64
- IPC: H01L33/64 ; H01L33/38 ; H01L33/44

Abstract:
A light emitting element includes: a semiconductor layered structure; a first electrically insulating film covering surfaces of the semiconductor layered structure and defining a first opening in each of a first region and a second region of a first semiconductor layer, and defining a second opening in a portion above a second semiconductor layer; a first electrode electrically connected to the first semiconductor layer through each first opening; a second electrode electrically connected to the second semiconductor layer through the second opening; a first terminal located on the first electrode and electrically connected to the first electrode; a second terminal located on the second electrode and electrically connected to the second electrode; and a metal member located on a portion of the first electrically insulating film located over the second semiconductor layer and electrically insulated from the first terminal and the second terminal.
Public/Granted literature
- US20220029079A1 LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE Public/Granted day:2022-01-27
Information query
IPC分类: