Invention Grant
- Patent Title: Emitter support structure and field emission device
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Application No.: US17761295Application Date: 2020-05-12
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Publication No.: US11615937B2Publication Date: 2023-03-28
- Inventor: Hayato Ochi , Rena Takahashi
- Applicant: MEIDENSHA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MEIDENSHA CORPORATION
- Current Assignee: MEIDENSHA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JPJP2019-169936 20190919
- International Application: PCT/JP2020/018913 WO 20200512
- International Announcement: WO2021/053876 WO 20210325
- Main IPC: H01J35/06
- IPC: H01J35/06

Abstract:
An emitter support structure for a field emission device, the emitter support structure includes: a support portion disposed to be moved in a direction of both ends of a vacuum chamber of the field emission device, and configured to support an emitter of the field emission device; a protruding portion formed at one end portion of the support portion which confronts a target of the field emission device, and to which the emitter is inserted and mounted; a slit formed in a circumference wall portion of the protruding portion in a height direction of the circumference wall portion; and a redundant brazing material groove formed in an outside of the protruding portion along the circumference wall portion.
Public/Granted literature
- US20220351930A1 EMITTER SUPPORT STRUCTURE AND FIELD EMISSION DEVICE Public/Granted day:2022-11-03
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