- 专利标题: Method of manufacturing cable assembly, horn chip used in the method and cable assembly manufactured by the method
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申请号: US17522868申请日: 2021-11-09
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公开(公告)号: US11616334B2公开(公告)日: 2023-03-28
- 发明人: Masayuki Shiratori , Kenji Kameda
- 申请人: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- 申请人地址: JP Tokyo
- 专利权人: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- 当前专利权人: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- 当前专利权人地址: JP Tokyo
- 代理机构: Holtz, Holtz & Volek PC
- 优先权: JPJP2021-000823 20210106
- 主分类号: H01K1/00
- IPC分类号: H01K1/00 ; H01R43/02 ; H01R4/02 ; H01R11/12
摘要:
A busbar is placed on an anvil, and a core wire of a cable is placed on the busbar. While the core wire is pressed onto the busbar using a horn chip, ultrasonic vibration is given to the core wire to join the core wire to the busbar. The horn chip has two flat portions and a recessed portion located between the flat portions. When the core wire is pressed onto the busbar using the horn chip, each of the flat portions and the busbar sandwich a part of the core wire therebetween while the recessed portion and the busbar put a remaining part of the core wire therebetween. Each of the sandwiched parts of the core wire does not reach an outer end of the corresponding flat portion to leave a space between the corresponding flat portion and the busbar.
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