Invention Grant
- Patent Title: Integrated circuit with radio frequency interconnect
-
Application No.: US15931273Application Date: 2020-05-13
-
Publication No.: US11616631B2Publication Date: 2023-03-28
- Inventor: Huan-Neng Chen , William Wu Shen , Chewn-Pu Jou , Feng Wei Kuo , Lan-Chou Cho , Tze-Chiang Huang , Jack Liu , Yun-Han Lee
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H04J3/00
- IPC: H04J3/00 ; H04L5/14 ; H04W52/02

Abstract:
An integrated circuit includes a first through fourth devices positioned over a substrate, the first device including first through third transceivers, the second device including a fourth transceiver, the third device including a fifth transceiver, and the fourth device including a sixth transceiver. A first radio frequency interconnect (RFI) includes the first transceiver coupled to the fourth transceiver through a first guided transmission medium, a second RFI includes the second transceiver coupled to the fifth transceiver through a second guided transmission medium, and a third RFI includes the third transceiver coupled to the sixth transceiver by the second guided transmission medium.
Public/Granted literature
- US20200274685A1 INTEGRATED CIRCUIT WITH RADIO FREQUENCY INTERCONNECT Public/Granted day:2020-08-27
Information query