- 专利标题: Biomaterials for enhanced implant-host integration
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申请号: US16589768申请日: 2019-10-01
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公开(公告)号: US11617817B2公开(公告)日: 2023-04-04
- 发明人: Christopher S. Chen , Jan D. Baranski , Ritika Chaturvedi , Michael T. Yang , Kelly Stevens , Sangeeta Bhatia
- 申请人: The Trustees of the University of Pennsylvania , Massachusetts Institute of Technology
- 申请人地址: US PA Philadelphia; US MA Cambridge
- 专利权人: The Trustees of the University of Pennsylvania,Massachusetts Institute of Technology
- 当前专利权人: The Trustees of the University of Pennsylvania,Massachusetts Institute of Technology
- 当前专利权人地址: US PA Philadelphia; US MA Cambridge
- 代理机构: McCarter & English, LLP
- 主分类号: A61L27/50
- IPC分类号: A61L27/50 ; A61K35/44 ; A61L27/22 ; A61L27/24 ; A61L27/38 ; A61L27/40 ; A61L27/36
摘要:
The present disclosure provides patterned biomaterials having organized cords and extracellular matrix embedded in a 3D scaffold. According, the present disclosure provides compositions and applications for patterned biomaterials. Pre-patterning of these biomaterials can lead to enhanced integration of these materials into host organisms, providing a strategy for enhancing the viability of engineered tissues by promoting vascularization.