Invention Grant
- Patent Title: Selective deposition of a passivation film on a metal surface
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Application No.: US17081482Application Date: 2020-10-27
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Publication No.: US11621161B2Publication Date: 2023-04-04
- Inventor: Yong Wang , Andrea Leoncini , Doreen Wei Ying Yong , Bhaskar Jyoti Bhuyan , John Sudijono
- Applicant: Applied Materials, Inc. , National University of Singapore
- Applicant Address: US CA Santa Clara; SG Singapore
- Assignee: Applied Materials, Inc.,National University of Singapore
- Current Assignee: Applied Materials, Inc.,National University of Singapore
- Current Assignee Address: US CA Santa Clara; SG Singapore
- Agency: Servilla Whitney LLC
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/455
Abstract:
Methods of selectively depositing films on substrates are described. A passivation film is deposited on a metal surface before deposition of a dielectric material. Also described is exposing a substrate surface comprising a metal surface and a dielectric surface to a docking precursor to form a passivation film.
Public/Granted literature
- US20220130664A1 Selective Deposition Of A Passivation Film On A Metal Surface Public/Granted day:2022-04-28
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