Invention Grant
- Patent Title: Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systems
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Application No.: US16892084Application Date: 2020-06-03
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Publication No.: US11621245B2Publication Date: 2023-04-04
- Inventor: Yeongbeom Ko , Youngik Kwon , Jungbae Lee
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/552 ; H01L25/18 ; H01L25/00 ; H01L21/56
Abstract:
This patent application relates to microelectronic device packages with internal EMI shielding, methods of fabricating and related electronic systems. One or more microelectronic devices of a package including multiple microelectronic devices are EMI shielded, and one or more other microelectronic devices of the package are located outside the EMI shielding.
Public/Granted literature
Information query
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