- Patent Title: Integrated assemblies and methods of forming integrated assemblies
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Application No.: US15931421Application Date: 2020-05-13
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Publication No.: US11621273B2Publication Date: 2023-04-04
- Inventor: Yiping Wang , Andrew Li , Haoyu Li , Matthew J. King , Wei Yeeng Ng , Yongjun Jeff Hu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L27/11582 ; H01L27/11524 ; H01L21/283 ; H01L27/1157 ; H01L21/306 ; H01L27/11556
Abstract:
Some embodiments include an integrated assembly having a first structure containing semiconductor material, and having a second structure contacting the first structure. The first structure has a composition along an interface with the second structure. The composition includes additive to a concentration within a range of from about 1018 atoms/cm3 to about 1021 atoms/cm3. The additive includes one or more of carbon, oxygen, nitrogen and sulfur. Some embodiments include methods of forming integrated assemblies.
Public/Granted literature
- US20210358940A1 Integrated Assemblies and Methods of Forming Integrated Assemblies Public/Granted day:2021-11-18
Information query
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