- Patent Title: Circuit member joint structure and circuit member joining method
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Application No.: US17109182Application Date: 2020-12-02
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Publication No.: US11622442B2Publication Date: 2023-04-04
- Inventor: Daisuke Tonaru
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2018-116219 20180619,JPJP2018-162259 20180831
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K1/14 ; H01L23/00 ; H05K3/28 ; H05K3/34 ; H05K1/18 ; H05K1/03

Abstract:
A circuit member joint structure includes a first circuit member including a first main surface on which a first mounting electrode is provided, a second circuit member including a second main surface on which a second mounting electrode is provided, a conductive joining material with which the first mounting electrode and the second mounting electrode are joined to each other, and an insulating joining material with which an end portion of the first circuit member and an end portion of the second circuit member are joined to each other. The first circuit member includes a first recess on the first main surface and spaced away from the first mounting electrode, and at least a portion of the insulating joining material is disposed in the first recess.
Public/Granted literature
- US20210092832A1 CIRCUIT MEMBER JOINT STRUCTURE AND CIRCUIT MEMBER JOINING METHOD Public/Granted day:2021-03-25
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