Invention Grant
- Patent Title: Substrate structure, semiconductor package structure and method for manufacturing semiconductor package structure
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Application No.: US17204833Application Date: 2021-03-17
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Publication No.: US11631633B2Publication Date: 2023-04-18
- Inventor: You-Lung Yen , Kuang-Hsiung Chen , Bernd Karl Appelt
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/31 ; H01L21/768 ; H01L21/50

Abstract:
A substrate structure and a semiconductor package structure including the same are provided. The substrate structure includes a circuit layer and a dielectric structure. The circuit layer has a bottom surface and a top surface opposite to the bottom surface. The dielectric structure around the circuit layer. The dielectric structure covers a first part of the bottom surface of the circuit layer, and exposes a second part of the bottom surface and the top surface of the circuit layer. The dielectric structure exposes the top surface of the circuit layer. In addition, a method of manufacturing a semiconductor package structure is also provided.
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Information query
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