Invention Grant
- Patent Title: Non-volatile memory structure using semiconductor layer as floating gate and bulk semiconductor substrate as channel region
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Application No.: US17147684Application Date: 2021-01-13
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Publication No.: US11631772B2Publication Date: 2023-04-18
- Inventor: Thomas Melde , Stefan Dünkel , Ralf Richter
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Hoffman Warnick LLC
- Agent Yee Tze Lim
- Main IPC: H01L27/11521
- IPC: H01L27/11521 ; H01L29/788 ; H01L29/423 ; H01L27/12

Abstract:
A non-volatile memory (NVM) structure includes a first memory device including: a first inter-poly dielectric defined by an isolation layer over a first semiconductor layer over an insulator layer (SOI) stack over a bulk semiconductor substrate, a first tunneling insulator defined by the insulator layer, a first floating gate defined by the semiconductor layer of the SOI stack, and a first channel region defined in the bulk semiconductor substrate between a source region and a drain region. The memory device may also include a control gate over the SOI stack, an erase gate over a source region in the bulk substrate, and a bitline contact coupled to a drain region in the bulk substrate. The NVM structure may also include another memory device similar to the first memory device and sharing the source region.
Public/Granted literature
Information query
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