Invention Grant
- Patent Title: Expansion apparatus, shaping system, and manufacturing method of shaped object
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Application No.: US16689138Application Date: 2019-11-20
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Publication No.: US11633906B2Publication Date: 2023-04-25
- Inventor: Yuji Horiuchi , Kenji Iwamoto
- Applicant: CASIO COMPUTER CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Scully Scott Murphy & Presser
- Priority: JPJP2018-228745 20181206
- Main IPC: B29C61/04
- IPC: B29C61/04 ; B29C61/06 ; B29K701/12

Abstract:
An expansion apparatus includes: a first expander for irradiating with electromagnetic waves emitted from a lamp a thermal conversion layer for conversion of the electromagnetic waves to heat, to cause at least a portion of a thermal expansion layer to expand, the thermal conversion layer being laminated to a molding sheet including a base and the thermal expansion layer laminated to a first main surface of the base; and a second expander for causing expansion of a region (C) of the thermal expansion layer that is smaller in size than a region (B) of the thermal expansion layer expanded by the first expander.
Public/Granted literature
- US20200180212A1 EXPANSION APPARATUS, SHAPING SYSTEM, AND MANUFACTURING METHOD OF SHAPED OBJECT Public/Granted day:2020-06-11
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