Invention Grant
- Patent Title: Apparatus for bonding substrates having a substrate holder with holding fingers and method of bonding substrates
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Application No.: US16507407Application Date: 2019-07-10
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Publication No.: US11640912B2Publication Date: 2023-05-02
- Inventor: Jun-Hyung Kim , Sung-Hyup Kim , Tae-Yeong Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2018-0103029 20180830
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L23/00 ; H01L21/687 ; H01L21/673 ; H01L25/00
Abstract:
A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.
Public/Granted literature
- US20200075360A1 APPARATUS FOR BONDING SUBSTRATES AND METHOD OF BONDING SUBSTRATES Public/Granted day:2020-03-05
Information query
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