A hot melt adhesive composed of a styrene-butadiene-styrene polymer having a relatively high diblock content and styrene content, a second styrenic block copolymer having a lower diblock content than the styrene-butadiene-styrene polymer, which is preferably a styrene-isoprene-styrene polymer, together with tackifying resin, and liquid plasticizer. The preferred styrene-butadiene-styrene polymer contains a styrene content of greater than 30 percent and a diblock content greater than 30 percent by weight. When used in conjunction with a styrene-isoprene-styrene polymer, the hot melt composition provides improved peel strength at 5° C., and when used as a pad attachment positioning adhesive, did not exhibit adhesive transfer at 40° C.