公开(公告)号：US20150203725A1

公开(公告)日：2015-07-23

申请号：US14598468

申请日：2015-01-16

Applicant: Bostik, Inc.

Inventor： Kevin Stafeil ,  Kelley Gerschke ,  Kyle Gerarden

IPC: C09J153/02

CPC classification number: C09J153/02 ,  C08L53/02 ,  C08L2205/02

Abstract: A hot melt adhesive composed of a styrene-butadiene-styrene polymer having a relatively high diblock content and styrene content, a second styrenic block copolymer having a lower diblock content than the styrene-butadiene-styrene polymer, which is preferably a styrene-isoprene-styrene polymer, together with tackifying resin, and liquid plasticizer. The preferred styrene-butadiene-styrene polymer contains a styrene content of greater than 30 percent and a diblock content greater than 30 percent by weight. When used in conjunction with a styrene-isoprene-styrene polymer, the hot melt composition provides improved peel strength at 5° C., and when used as a pad attachment positioning adhesive, did not exhibit adhesive transfer at 40° C.

Abstract translation: 由具有相对高的二嵌段含量的苯乙烯 - 丁二烯 - 苯乙烯聚合物和苯乙烯含量组成的热熔粘合剂，具有比苯乙烯 - 丁二烯 - 苯乙烯聚合物更低的二嵌段含量的第二苯乙烯嵌段共聚物，其优选为苯乙烯 - 异戊二烯 - 苯乙烯聚合物，增粘树脂和液体增塑剂。 优选的苯乙烯 - 丁二烯 - 苯乙烯聚合物含有大于30％的苯乙烯含量和大于30重量％的二嵌段含量。 当与苯乙烯 - 异戊二烯 - 苯乙烯聚合物一起使用时，热熔组合物在5℃下提供改善的剥离强度，并且当用作垫附着定位粘合剂时，在40℃下不显示粘合剂转移。

公开(公告)号：US11643578B2

公开(公告)日：2023-05-09

申请号：US14598468

申请日：2015-01-16

Applicant: Bostik, Inc.

Inventor： Kevin Stafeil ,  Kelley Gerschke ,  Kyle Gerarden

IPC: C09J153/02 ,  C08L53/02

CPC classification number: C09J153/02 ,  C08L53/02 ,  C08L2205/02 ,  C09J153/02 ,  C08L53/02

Abstract: A hot melt adhesive composed of a styrene-butadiene-styrene polymer having a relatively high diblock content and styrene content, a second styrenic block copolymer having a lower diblock content than the styrene-butadiene-styrene polymer, which is preferably a styrene-isoprene-styrene polymer, together with tackifying resin, and liquid plasticizer. The preferred styrene-butadiene-styrene polymer contains a styrene content of greater than 30 percent and a diblock content greater than 30 percent by weight. When used in conjunction with a styrene-isoprene-styrene polymer, the hot melt composition provides improved peel strength at 5° C., and when used as a pad attachment positioning adhesive, did not exhibit adhesive transfer at 40° C.

公开(公告)号：US11912906B2

公开(公告)日：2024-02-27

申请号：US14329058

申请日：2014-07-11

Applicant: Bostik, Inc.

Inventor： Kevin Stafeil ,  Kathleen M Farris

IPC: C09J157/02 ,  A61L15/24 ,  A61L15/58 ,  B32B5/02 ,  B32B5/26 ,  B32B7/12 ,  B32B37/12 ,  C08L23/08 ,  C08L53/02 ,  C08L91/00 ,  C09J11/08 ,  C09J123/08 ,  C09J153/02

CPC classification number: C09J157/02 ,  A61L15/24 ,  A61L15/585 ,  B32B5/022 ,  B32B5/26 ,  B32B7/12 ,  B32B37/1207 ,  B32B37/1292 ,  C08L23/0853 ,  C08L53/02 ,  C08L91/00 ,  C09J11/08 ,  C09J123/0853 ,  C09J153/02 ,  B32B2037/1215 ,  B32B2250/02 ,  B32B2250/20 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2405/00 ,  B32B2439/00 ,  B32B2519/00 ,  B32B2535/00 ,  B32B2555/02 ,  C09J2301/304 ,  Y02P20/582 ,  Y10T428/2891 ,  Y10T442/60 ,  Y10T442/659 ,  Y10T442/674 ,  C09J123/0853 ,  C08L53/02 ,  C08L91/00 ,  C09J153/02 ,  C08L23/0853 ,  C08L91/00

Abstract: A hot melt adhesive composed of an ethylene vinyl acetate copolymer, a hydrogenated styrenic block copolymer, a tackifying resin, and a liquid plasticizer. The preferred ethylene vinyl acetate copolymer has a vinyl acetate content between 8 and 28 percent by weight, and the preferred hydrogenated styrenic block copolymer is a styrene-ethylene-butylene-styrene having about 30% styrene content and essentially no diblock. The hot melt gives excellent peel strength when used as a construction adhesive for disposable nonwoven articles. It can also be formulated to exhibit very low bleed through and blocking characteristics when used on low basis weight nonwoven fabrics.

公开(公告)号：US20130090421A1

公开(公告)日：2013-04-11

申请号：US13646421

申请日：2012-10-05

Applicant: BOSTIK, INC.

Inventor： Michael Vitrano ,  Kevin Stafeil ,  Richard Maggard

IPC: C09J153/00 ,  C09J153/02

CPC classification number: C09J153/02 ,  C08L23/06 ,  C08L23/0853 ,  C08L53/02 ,  C08L2314/06 ,  C09J123/0815 ,  C09J123/0853 ,  C09J123/0869 ,  C09J123/142 ,  C09J191/06 ,  C09J193/04

Abstract: A novel hot melt adhesive for bonding labels on plastic bottles is described. The adhesive comprises a blend of a styrenic block copolymer, an ethylene vinyl acetate copolymer, a tackifying resin, petrolatum and optionally a wax. The use of petrolatum instead of mineral oil provides for better elevated temperature resistance than traditional formulations.

Abstract translation: 描述了一种用于在塑料瓶上粘合标签的新型热熔粘合剂。 粘合剂包括苯乙烯嵌段共聚物，乙烯乙酸乙烯酯共聚物，增粘树脂，凡士林和任选的蜡的共混物。 使用凡士林而不是矿物油提供比传统配方更好的耐高温性。

公开(公告)号：US20150017868A1

公开(公告)日：2015-01-15

申请号：US14329058

申请日：2014-07-11

Applicant: Bostik Inc.

Inventor： Kevin Stafeil ,  Kathleen M. Farris

IPC: C09J157/02 ,  A61L15/24 ,  B32B37/12 ,  B32B5/02 ,  B32B5/26 ,  B32B7/12 ,  C09J7/04 ,  A61L15/58

CPC classification number: C09J157/02 ,  A61L15/24 ,  A61L15/585 ,  B32B5/022 ,  B32B5/26 ,  B32B7/12 ,  B32B37/1207 ,  B32B37/1292 ,  B32B2037/1215 ,  B32B2250/02 ,  B32B2250/20 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2405/00 ,  B32B2439/00 ,  B32B2519/00 ,  B32B2535/00 ,  B32B2555/02 ,  C08L23/0853 ,  C08L53/02 ,  C08L91/00 ,  C09J11/08 ,  C09J123/0853 ,  C09J153/02 ,  C09J2201/61 ,  Y02P20/582 ,  Y10T428/2891 ,  Y10T442/60 ,  Y10T442/659 ,  Y10T442/674

Abstract: A hot melt adhesive composed of an ethylene vinyl acetate copolymer, a hydrogenated styrenic block copolymer, a tackifying resin, and a liquid plasticizer. The preferred ethylene vinyl acetate copolymer has a vinyl acetate content between 8 and 28 percent by weight, and the preferred hydrogenated styrenic block copolymer is a styrene-ethylene-butylene-styrene having about 30% styrene content and essentially no diblock. The hot melt gives excellent peel strength when used as a construction adhesive for disposable nonwoven articles. It can also be formulated to exhibit very low bleed through and blocking characteristics when used on low basis weight nonwoven fabrics.

Abstract translation: 由乙烯 - 乙酸乙烯酯共聚物，氢化苯乙烯嵌段共聚物，增粘树脂和液体增塑剂组成的热熔粘合剂。 优选的乙烯 - 乙酸乙烯酯共聚物的乙酸乙烯酯含量为8至28重量％，优选的氢化苯乙烯嵌段共聚物是苯乙烯 - 乙烯 - 丁烯 - 苯乙烯，其苯乙烯含量约为30％，基本上不含二嵌段。 当用作一次性无纺布制品的结构粘合剂时，热熔胶具有优异的剥离强度。 当用于低重量的无纺织物时，它也可以配制成具有非常低的渗透和阻塞特性。