- 专利标题: Composite structure with aluminum-based alloy layer containing boron carbide and manufacturing method thereof
-
申请号: US17493863申请日: 2021-10-05
-
公开(公告)号: US11643715B2公开(公告)日: 2023-05-09
- 发明人: Wu-Han Liu , Yi-Liang Liao , Tai-Sheng Chen , Wei-Tien Hsiao , Chang-Chih Hsu
- 申请人: Industrial Technology Research Institute
- 申请人地址: TW Hsinchu
- 专利权人: Industrial Technology Research Institute
- 当前专利权人: Industrial Technology Research Institute
- 当前专利权人地址: TW Hsinchu
- 代理机构: JCIPRNET
- 优先权: TW 0133235 2021.09.07
- 主分类号: C23C4/10
- IPC分类号: C23C4/10 ; C23C4/06 ; C22C29/06 ; B32B15/01 ; B32B3/26 ; B32B15/20 ; B32B15/04 ; C22C32/00 ; C22C29/02 ; C22C30/00 ; C22C1/05 ; C22C29/14 ; C22C1/051 ; C22C29/00 ; C22C21/00 ; C23C4/067 ; B32B3/30 ; C22C1/02 ; C22C1/053
摘要:
A composite structure with an aluminum-based alloy layer containing boron carbide and a manufacturing method thereof are provided. The composite structure includes a substrate with an open hole in that surface and the aluminum-based alloy layer containing boron carbide. The aluminum-based alloy layer is disposed in the open hole and contains aluminum, boron, carbon, and oxygen, wherein the content of aluminum is between 4 at. % and 55 at. %, the content of boron is between 9 at. % and 32 at. %, the content of carbon is between 13 at. % and 32 at. %, the content of oxygen is between 2 at. % and 38 at. %, and the ratio of the content of boron to carbon is between 0.3 and 2.7.
公开/授权文献
信息查询
IPC分类: