Invention Grant
- Patent Title: Data analytics for mitigation of data center thermal issues
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Application No.: US17301378Application Date: 2021-03-31
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Publication No.: US11644876B2Publication Date: 2023-05-09
- Inventor: Anil Kumar Narigapalli , Laxmikantha Sai Nanduru , Venkateswarlu Basyam , Srilakshmi Surapaneni
- Applicant: KYNDRYL, INC.
- Applicant Address: US NY New York
- Assignee: Kyndryl, Inc.
- Current Assignee: Kyndryl, Inc.
- Current Assignee Address: US NY New York
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20

Abstract:
Mitigating the impact of data center thermal environmental issues on production applications includes retrieving, by a computer, from a centralized repository first data corresponding to I/O and processing activities of an infrastructure component executing one or more applications, second data corresponding to an application-to-infrastructure map, and third data corresponding to a business priority of the one or more applications. Based on the first data and the second data, the one or more applications are mapped to heat generation values of the infrastructure component, and based on the mapping a thermal load of the one or more applications on the infrastructure component is determined using data analytics. Using the third data, the computer identifies an execution priority for the one or more applications, generates a correlative mapping between the execution priority and the thermal load of the one or more applications, and generates a resolution plan based on the correlative mapping.
Public/Granted literature
- US20220317744A1 DATA ANALYTICS FOR MITIGATION OF DATA CENTER THERMAL ISSUES Public/Granted day:2022-10-06
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