Invention Grant
- Patent Title: Chip resistor and method of manufacturing chip resistor
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Application No.: US17703798Application Date: 2022-03-24
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Publication No.: US11646136B2Publication Date: 2023-05-09
- Inventor: Homare Sasaki , Yasuhiro Kamijo
- Applicant: KOA CORPORATION
- Applicant Address: JP Ina
- Assignee: KOA CORPORATION
- Current Assignee: KOA CORPORATION
- Current Assignee Address: JP Ina
- Agency: Oliff PLC
- Priority: JP 2021064208 2021.04.05
- Main IPC: H01C7/00
- IPC: H01C7/00 ; H01C17/00 ; H01C17/22 ; H01C1/14

Abstract:
A chip resistor includes an insulated substrate having a rectangular parallelepiped shape, a first front electrode and a second front electrode created on both longitudinal ends of the insulated substrate, and a resistive element making a connection between the first and second front electrodes. The resistive element is formed in a meandering shape with a first region and a second region continuing in series via a jointing section between a pair of connecting portions. Moreover, in the first region, a first trimming groove for rough adjustment is formed to elongate a current path of the resistive element. In the second region, a second trimming groove is formed for fine adjustment extending in a direction angled with respect to a straight line along a direction in which the first trimming groove extends.
Public/Granted literature
- US20220319745A1 CHIP RESISTOR AND METHOD OF MANUFACTURING CHIP RESISTOR Public/Granted day:2022-10-06
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