A method for calibrating a second bonding machine based on a calibrated first bonding machine is disclosed. The first bonding machine includes a first ultrasonic transducer. The second bonding machine includes a second ultrasonic transducer and a power supply. The method includes providing a first electrical calibration supply that causes the first ultrasonic transducer to oscillate at a first calibration amplitude when it is damped by a mechanical damping, providing a second electrical calibration supply that causes the second ultrasonic transducer to oscillate at the same calibration amplitude when it is damped by the same mechanical damping. The second bonding machine is adapted to modify a second control signal based on a first electrical parameter of the first electrical calibration supply and on a second electrical parameter of the second electrical calibration supply in order to generate a modified second control signal, provide the modified second control signal to the power supply in order to cause the second power supply to generate a second electrical supply, and provide the second electrical supply to the second ultrasonic transducer.