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公开(公告)号：US11646291B2
公开(公告)日：2023-05-09
申请号：US16527289
申请日：2019-07-31
Applicant: Infineon Technologies AG
Inventor： Florian Eacock , Michal Chajneta , Stefan Tophinke
CPC classification number: H01L24/78 , G05B19/182 , G05B2219/37008 , G05B2219/45033 , H01L2224/78001 , H01L2224/78343
Abstract: A method for calibrating a second bonding machine based on a calibrated first bonding machine is disclosed. The first bonding machine includes a first ultrasonic transducer. The second bonding machine includes a second ultrasonic transducer and a power supply. The method includes providing a first electrical calibration supply that causes the first ultrasonic transducer to oscillate at a first calibration amplitude when it is damped by a mechanical damping, providing a second electrical calibration supply that causes the second ultrasonic transducer to oscillate at the same calibration amplitude when it is damped by the same mechanical damping. The second bonding machine is adapted to modify a second control signal based on a first electrical parameter of the first electrical calibration supply and on a second electrical parameter of the second electrical calibration supply in order to generate a modified second control signal, provide the modified second control signal to the power supply in order to cause the second power supply to generate a second electrical supply, and provide the second electrical supply to the second ultrasonic transducer.
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公开(公告)号：US20190312008A1
公开(公告)日：2019-10-10
申请号：US16374043
申请日：2019-04-03
Applicant: Infineon Technologies AG
Inventor： Florian Eacock , Marian Sebastian Broll , Stefan Tophinke
Abstract: A method comprises heating a first electrically conductive layer that is to be electrically contacted, and that is arranged on a first element, and pressing a first end of a bonding wire on the first electrically conductive layer by exerting pressure to the first end of the bonding wire, and further by exposing the first end of the bonding wire to ultrasonic energy, thereby deforming the first end of the bonding wire and creating a permanent substance-to-substance bond between the first end of the bonding wire and the first electrically conductive layer. The bonding wire either comprises a rounded cross section with a diameter of at least 125 μm or a rectangular cross section with a first width of at least 500 μm and a first height of at least 50 μm.
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公开(公告)号：US20200043883A1
公开(公告)日：2020-02-06
申请号：US16527289
申请日：2019-07-31
Applicant: Infineon Technologies AG
Inventor： Florian Eacock , Michal Chajneta , Stefan Tophinke
Abstract: A method for calibrating a second bonding machine based on a calibrated first bonding machine is disclosed. The first bonding machine includes a first ultrasonic transducer. The second bonding machine includes a second ultrasonic transducer and a power supply. The method includes providing a first electrical calibration supply that causes the first ultrasonic transducer to oscillate at a first calibration amplitude when it is damped by a mechanical damping, providing a second electrical calibration supply that causes the second ultrasonic transducer to oscillate at the same calibration amplitude when it is damped by the same mechanical damping. The second bonding machine is adapted to modify a second control signal based on a first electrical parameter of the first electrical calibration supply and on a second electrical parameter of the second electrical calibration supply in order to generate a modified second control signal, provide the modified second control signal to the power supply in order to cause the second power supply to generate a second electrical supply, and provide the second electrical supply to the second ultrasonic transducer.
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公开(公告)号：US20190356098A1
公开(公告)日：2019-11-21
申请号：US16411950
申请日：2019-05-14
Applicant: Infineon Technologies AG
Inventor： Florian Eacock , Guido Strotmann , Alparslan Takkac
Abstract: One aspect relates to a method that includes bonding an electrically conductive element to a bonding surface of a bonding partner by increasing a temperature of a bonding section of the electrically conductive element from an initial temperature to an increased temperature by passing an electric heating current through the bonding section, and pressing the bonding section with a pressing force against the bonding surface using a sonotrode and introducing an ultrasonic vibration into the bonding section via the sonotrode such that the increased temperature of the bonding section, the ultrasonic signal in the bonding section and the pressing force are simultaneously present and cause the formation of a tight and direct bond between the bonding section and the bonding surface.
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