Invention Grant
- Patent Title: Method of fabricating array substrate, array substrate and display device
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Application No.: US17328393Application Date: 2021-05-24
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Publication No.: US11646327B2Publication Date: 2023-05-09
- Inventor: Wei Yang , Xinhong Lu
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Myers Bigel, P.A.
- Priority: CN 1810215915.2 2018.03.15
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/66 ; H01L29/786 ; H10K59/121

Abstract:
A display device is disclosed. The display device includes a display area and a wiring area. The display area is disposed with a first thin film transistor which is an oxide thin film transistor and a second thin film transistor which is a low temperature poly-silicon thin film transistor. A distance between a first active layer of the first thin film transistor and a substrate is different from a distance between a second active layer of the second thin film transistor and the substrate. The first thin film transistor includes first vias that receive a first source/drain. The second thin film transistor includes second vias that receives a second source/drain. The wiring area is provided with a groove. The groove includes a first sub-groove and a second sub-groove that are stacked, and depths of the second vias are substantially equal to a depth of the second sub-groove.
Public/Granted literature
- US20210280615A1 METHOD OF FABRICATING ARRAY SUBSTRATE, ARRAY SUBSTRATE AND DISPLAY DEVICE Public/Granted day:2021-09-09
Information query
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