Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US17167286Application Date: 2021-02-04
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Publication No.: US11646378B2Publication Date: 2023-05-09
- Inventor: Tetsuhiro Tanaka , Mitsuhiro Ichijo , Toshiya Endo , Akihisa Shimomura , Yuji Egi , Sachiaki Tezuka , Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi
- Agency: Fish & Richardson P.C.
- Priority: JP 15083163 2015.04.15 JP 15110541 2015.05.29
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/423 ; H01L29/49

Abstract:
A transistor with stable electrical characteristics. A semiconductor device includes a first insulator over a substrate, a second insulator over the first insulator, an oxide semiconductor in contact with at least part of a top surface of the second insulator, a third insulator in contact with at least part of a top surface of the oxide semiconductor, a first conductor and a second conductor electrically connected to the oxide semiconductor, a fourth insulator over the third insulator, a third conductor which is over the fourth insulator and at least part of which is between the first conductor and the second conductor, and a fifth insulator over the third conductor. The first insulator contains a halogen element.
Public/Granted literature
- US20210184042A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-06-17
Information query
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