Invention Grant
- Patent Title: Optoelectronic devices with non-rectangular die shapes
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Application No.: US17174076Application Date: 2021-02-11
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Publication No.: US11646384B2Publication Date: 2023-05-09
- Inventor: Mathieu Charbonneau-Lefort , Saahil Mehra , Tongbi T. Jiang , Saijin Liu
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Aikin & Gallant, LLP
- Main IPC: H01L31/0352
- IPC: H01L31/0352 ; H01L31/0203 ; H01L31/02 ; H01L25/16 ; H01L25/04
Abstract:
An optoelectronic module may include one or more non-rectangular optoelectronic dies e.g., light emitting diodes and photodiodes, arranged to maximize the usage of surface area when mounted to a base circuit board. Multi-axis and non-orthogonal axis dicing processes can be used to form the dies which have non-rectangular shapes.
Public/Granted literature
- US20220254941A1 OPTOELECTRONIC DEVICES WITH NON-RECTANGULAR DIE SHAPES Public/Granted day:2022-08-11
Information query
IPC分类:
