- Patent Title: Resin composition for acoustic matching layer, acoustic matching sheet, acoustic wave probe, acoustic wave measuring apparatus, method for manufacturing acoustic wave probe, and material set for acoustic matching layer
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Application No.: US16863258Application Date: 2020-04-30
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Publication No.: US11649352B2Publication Date: 2023-05-16
- Inventor: Kazuhiro Hamada , Yoshihiro Nakai
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP 2017212211 2017.11.01
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08G59/50 ; G01N29/24 ; G10K11/18 ; G10K11/36 ; C08K5/14 ; C08K3/08

Abstract:
A resin composition for an acoustic matching layer; an acoustic matching sheet formed from the composition; an acoustic wave probe; an acoustic wave measuring apparatus; a method for manufacturing an acoustic wave probe; and a material set, for an acoustic matching layer, that is suitable for preparation of the composition, in which the resin composition for an acoustic matching layer includes a binder including a resin; and metal particles having a monodispersity of 40% to 80%, wherein the monodispersity is calculated by equation (1):
monodispersity (%)=(standard deviation of particle sizes of metal particles/average particle size of metal particles)×100.
monodispersity (%)=(standard deviation of particle sizes of metal particles/average particle size of metal particles)×100.
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