Invention Grant
- Patent Title: Deposition mask and method of manufacturing deposition mask
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Application No.: US17305731Application Date: 2021-07-14
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Publication No.: US11649540B2Publication Date: 2023-05-16
- Inventor: Yasuhiro Uchida , Sachiyo Matsuura , Chikao Ikenaga
- Applicant: Dai Nippon Printing Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Burr Patent Law, PLLC
- Priority: JP 2017005999 2017.01.17 JP 2017238989 2017.12.13
- The original application number of the division: US16512697 2019.07.16
- Main IPC: C23C14/04
- IPC: C23C14/04 ; C23F1/02 ; H01L51/00 ; H01L51/56 ; B05C21/00

Abstract:
A deposition mask includes: a first surface and a second surface, in which a plurality of through-holes are formed; a pair of long side surfaces connected to the first and second surfaces, and defining a profile of the deposition mask in a longitudinal direction of the deposition mask; and a pair of short side surfaces connected to the first and second surfaces, and defining a profile of the deposition mask in a width direction of the deposition mask. The long side surface includes a first portion that is recessed inside and includes a first end portion positioned along the first surface, and a second end portion positioned along the second surface and positioned inside the first end portion. The through-hole includes a first recess formed on the first surface, and a second recess formed on the second surface and connected to the first recess through a hole connection portion.
Public/Granted literature
- US20210340665A1 DEPOSITION MASK AND METHOD OF MANUFACTURING DEPOSITION MASK Public/Granted day:2021-11-04
Information query
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