Invention Grant
- Patent Title: Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
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Application No.: US17721887Application Date: 2022-04-15
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Publication No.: US11650383B2Publication Date: 2023-05-16
- Inventor: Eric J. Zbinden , Thomas A. Hall, III
- Applicant: Samtec, Inc.
- Applicant Address: US IN New Albany
- Assignee: SAMTEC, INC.
- Current Assignee: SAMTEC, INC.
- Current Assignee Address: US IN New Albany
- Agency: Keating & Bennett, LLP
- Main IPC: G02B6/42
- IPC: G02B6/42 ; G02B6/38

Abstract:
An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.
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