Invention Grant
- Patent Title: Piezoelectric vibration module and haptic feedback module
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Application No.: US16952894Application Date: 2020-11-19
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Publication No.: US11650664B2Publication Date: 2023-05-16
- Inventor: Yung Ting , Sheuan-Perng Lin , Jun-Hong Lin , Zih-Jie Lin
- Applicant: CHUNG-YUAN CHRISTIAN UNIVERSITY
- Applicant Address: TW Chung Li
- Assignee: CHUNG-YUAN CHRISTIAN UNIVERSITY
- Current Assignee: CHUNG-YUAN CHRISTIAN UNIVERSITY
- Current Assignee Address: TW Chung Li
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW 9118041 2020.05.29
- Main IPC: G06F3/041
- IPC: G06F3/041 ; G06F3/01
Abstract:
A piezoelectric vibration module has a first soft circuit board and a plurality of piezoelectric units. The first soft circuit board includes a plurality of cutting areas. Two adjacent cutting areas are spaced with a cut through groove. Each piezoelectric unit is respectively configured below each cutting area.
Public/Granted literature
- US20210373666A1 PIEZOELECTRIC VIBRATION MODULE AND HAPTIC FEEDBACK MODULE Public/Granted day:2021-12-02
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