Invention Grant
- Patent Title: Multilayer electronic component having moisture-proof layer on body thereof
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Application No.: US16834243Application Date: 2020-03-30
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Publication No.: US11651900B2Publication Date: 2023-05-16
- Inventor: Chae Min Park , Ji Hong Jo , Woong Shin , Jae Hyun Lee , Hyun Woo Seung , Woo Chui Shin
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190115902 2019.09.20
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G4/12 ; H01G2/02 ; C04B35/468

Abstract:
A multilayer electronic component includes a body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers interposed therebetween, and first and second surfaces opposing each other in a direction by which the internal electrodes are laminated, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a moisture-proof layer disposed on at least one surface of anyone of the first, second, fifth, or sixth surface and containing a rare-earth oxide; a first external electrode disposed on the third surface and connected to the first internal electrodes; and a second external electrode disposed on the fourth surface and connected to the second internal electrodes.
Public/Granted literature
- US20210090806A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2021-03-25
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