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    Multilayer ceramic electronic component
    2.
    发明授权
    Multilayer ceramic electronic component 有权

    公开(公告)号：US10395839B1

    公开(公告)日：2019-08-27

    申请号：US16253705

    申请日：2019-01-22

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Chae Min Park ,  Ki Won Kim ,  Ji Hee Moon ,  Dong Hwi Shin ,  Sang Soo Park ,  Woo Chul Shin

    IPC: B32B15/08 ,  H01G4/30 ,  H01G2/06 ,  H01G4/12 ,  H01G4/008 ,  H01G4/14

    Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrodes disposed on first and second external surfaces of the ceramic body, respectively, the first and second external electrodes each including first and second base electrode layers having at least a portion in contact with first and second external surfaces of the ceramic body, respectively, and first and second plating layers, and a water repellent layer including a portion disposed to cover a gap between the ceramic body and the first and second plating layers, having a first thickness and a portion disposed to cover a surface of the ceramic body, to having a second thickness, smaller than the first thickness.

    MULTILAYER CERAMIC CAPACITOR
    3.
    发明公开
    MULTILAYER CERAMIC CAPACITOR 审中-公开

    公开(公告)号：US20240312717A1

    公开(公告)日：2024-09-19

    申请号：US18415009

    申请日：2024-01-17

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Youngjun Cha ,  Chae Min Park ,  Seonho Kim ,  Yong-Won Seo

    IPC: H01G4/30 ,  H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/224 ,  H01G4/232

    CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/008 ,  H01G4/012 ,  H01G4/224 ,  H01G4/232

    Abstract: A multilayer ceramic capacitor includes a ceramic body, a plurality of first and second internal electrodes having a dielectric layer therebetween in the ceramic body, first and second external electrodes including a body portion covering both end surfaces spaced apart from each other along a length direction of the ceramic body, respectively, a first band portion extending from the body portion and covering a part of a first surface of the ceramic body in a thickness direction, and a second band portion covering a part of a second surface facing the first surface and being longer than the first band portion, first and second cover layers that are disposed in the ceramic body along the thickness direction of the ceramic body, and a first cladding layer between the second cover layer, the second band portion of the first external electrode, and the second band portion of the second external electrode.

    MULTILAYER ELECTRONIC COMPONENT
    4.
    发明公开
    MULTILAYER ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20240290540A1

    公开(公告)日：2024-08-29

    申请号：US18437561

    申请日：2024-02-09

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyung Duk Yun ,  Byung Jun Jeon ,  Chae Min Park ,  Yong Won Seo ,  Ho In Jun ,  A Ra Cho

    IPC: H01G4/008 ,  H01G4/232 ,  H01G4/30

    CPC classification number: H01G4/0085 ,  H01G4/2325 ,  H01G4/30

    Abstract: Provided is a multilayer electronic component according to an example embodiment of the present disclosure including: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and including Ni; and an external electrode disposed on the body and connected to the internal electrode, wherein the external electrode includes a base electrode layer including Ni and Pd, and the internal electrode includes a first region, and a content of Pd included in the first region is greater than a content of Pd included in a remaining region, excluding the first region in the internal electrode.

    Multilayer electronic component
    5.
    发明授权
    Multilayer electronic component 有权

    公开(公告)号：US12002629B2

    公开(公告)日：2024-06-04

    申请号：US17856452

    申请日：2022-07-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Chae Min Park

    IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224 ,  H01G4/232

    CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224 ,  H01G4/232

    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, an external electrode disposed outside the body, and sealing portions disposed on outer surfaces of the body, wherein the external electrodes and the sealing portions include glass, the sealing portions include first sealing portions that are disposed between the body and the external electrodes, and second sealing portions that extend from the first sealing portions in the second direction and are not in contact with the external electrodes, and an average length of the second sealing portion is 20 μm or more.

    MULTILAYER CERAMIC CAPACITOR
    7.
    发明公开
    MULTILAYER CERAMIC CAPACITOR 审中-公开

    公开(公告)号：US20240304386A1

    公开(公告)日：2024-09-12

    申请号：US18585603

    申请日：2024-02-23

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seonho Kim ,  Chae Min Park ,  Yong-Won Seo ,  Youngjun Cha

    IPC: H01G4/012 ,  H01G4/232 ,  H01G4/30

    CPC classification number: H01G4/012 ,  H01G4/2325 ,  H01G4/30

    Abstract: A multilayer ceramic capacitor includes: a ceramic body; external electrodes each including a connection portion covering a part of an end surface of the ceramic body in a length direction, and a band portion extending from the connection portion and covering a part of both side surfaces of the ceramic body in a width direction and a part of one surface in a thickness direction; a plurality of internal electrodes stacked within the ceramic body with a dielectric layer interposed therebetween and alternately connected to the external electrodes, respectively; cover layers respectively disposed outside the plurality of internal electrodes along the thickness direction within the ceramic body; and a dummy electrode disposed within the first cover layer, wherein the first cover layer includes an exposed surface, which is a portion of the end surface exposed by the connection portion.

    MULTILAYER CERAMIC CAPACITOR
    8.
    发明公开
    MULTILAYER CERAMIC CAPACITOR 审中-公开

    公开(公告)号：US20240304383A1

    公开(公告)日：2024-09-12

    申请号：US18419026

    申请日：2024-01-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seonho Kim ,  Chae Min Park ,  Yong-Won Seo ,  Youngjun Cha

    IPC: H01G4/005 ,  H01G4/12

    CPC classification number: H01G4/005 ,  H01G4/12

    Abstract: A multilayer ceramic capacitor having a thickness smaller than a width thereof includes: a ceramic main body including first and second surfaces opposite to each other in a first direction, third and fourth surfaces opposite to each other in a second direction, fifth and sixth surfaces opposite to each other in a third direction: a first cover layer including a first dummy electrode pattern adjoining to an internal electrode closest to the fifth surface among the plurality of first and second internal electrodes; and a second cover layer including a second dummy electrode pattern adjoining to an internal electrode closest to the sixth surface among the plurality of first and second internal electrodes.

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