Invention Grant
- Patent Title: Inorganic encapsulant for electronic component with adhesion promoter
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Application No.: US16913188Application Date: 2020-06-26
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Publication No.: US11652012B2Publication Date: 2023-05-16
- Inventor: Edmund Riedl , Steffen Jordan , Stefan Miethaner , Stefan Schwab
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE 2019117534.8 2019.06.28
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L21/56
Abstract:
A package includes an electronic component, an inorganic encapsulant encapsulating at least part of the electronic component, and an adhesion promoter between at least part of the electronic component and the encapsulant.
Information query
IPC分类:
